舰面集约化无人操控设备受限于极有限的安置空间,经受海洋复杂环境考验,造成高密大功率发热组件热量嵌层堆积。本文对设备可靠性设计影响因素以及抗聚热设计的基本原则进行阐述,对热散耗功率预计得到热源分布,运用抗海风阻流风道设计及抗太阳辐射温升设计原理,提供一种简单有效适用于户外环境的高效密闭集约化机箱散热方案。设备采用遮阳内腔风道设计和独特的倒T型负压风腔设计方式,结合一系列工艺措施,具有密闭、遮阳、屏蔽及散热效果好的优点,为今后相关领域抗聚热设计提供一种参考方案。通过热散耗仿真和实验热测试及用户端近2年的使用反馈,验证了设备抗聚热设计的有效性,为后续该类设备的应用奠定基础。
The intensive unmanned control equipment on the surface of the ship is confined to a very limited space, which has been tested by the complex marine environment, resulting in a thermal build-up of high-power heating components in the high density, in this paper, the influence factors of equipment reliability design and the basic principle of anti-heat accumulation design are expounded, the distribution of heat source is predicted by heat dissipation power, and the design principles of anti-wind resistance duct and anti-solar radiation temperature rise are applied, this paper presents a heat dissipation scheme of high efficient and compact enclosure which is simple and effective for outdoor environment. The equipment adopts the design of sunshade inner air duct and the unique inverted t-type negative pressure air duct, and combines a series of technological measures, the utility model has the advantages of airtight, shading, shielding and good heat dissipation effect, and provides a reference scheme for anti-heat accumulation design in related fields in the future. Through thermal dissipation simulation, experimental thermal test and user feedback in the past two years, the effectiveness of the anti-heat accumulation design is verified, which lays a foundation for the future application of such equipment.
2022,44(13): 157-161 收稿日期:2021-09-27
DOI:10.3404/j.issn.1672-7649.2022.13.034
分类号:U664; TN8
作者简介:安娜(1969-),女,高级工程师,长期从事舰艇发射装置技术工作
参考文献:
[1] 张伦武. 何新洲. 环境对装备的影响及装备环境工程标准分析[J]. 环境工程. 2005, 2(6).
[2] 杨俊. 抗恶劣环境外部设备[M]. 电子科技出版社, 1992.
[3] 杨俊. 抗恶劣环境外部设备发展动态[J]. 抗恶劣环境计算机 1994(6).
[4] 张兴旺. 计算机设备的抗聚热设计[J]. 电子工艺技术, 2001(1): 36–40
[5] GJB299C-2006[S]. 电子设备可靠性预计手册.
[6] 丁小东. 电子设备抗聚热设计[R]. 信息产业部电子第四十五研究所, 2000(4).
[7] 肖卫兵. 舰载军用加固计算机的可靠性设计[J]. 电子机械工程, 2007(1): 21–23
[8] 余建祖. 电子设备抗聚热设计及分析技术[M]. 北京: 高等教育出版社, 2001.
[9] 张蕴华, 吴东旭. 高强度抗恶劣环境计算机机箱[R]. 中国航空第六三一研究所.
[10] 初云龙. 黄志奇. 抗恶劣环境计算机设计研究 [C]//中国计算机学会, 2007.